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SIMULTECH 2021 will be held in conjunction with ICSOFT 2021, DATA 2021, ICINCO 2021 and DeLTA 2021.
Registration to SIMULTECH allows free access to the ICSOFT, DATA, ICINCO and DeLTA conferences (as a non-speaker).


Upcoming Submission Deadlines

Regular Paper Submission: February 16, 2021
Position Paper Submission: April 1, 2021
Doctoral Consortium Paper Submission: May 12, 2021

(See Important Dates for more information)
The purpose of the International Conference on Simulation and Modeling Methodologies, Technologies and Applications (SIMULTECH) is to bring together researchers and practitioners from various fields interested in the technological advances and application challenges in all fields of modeling and simulation. The specific topics listed under each of these tracks highlight the interest of this conference in aspects related to computing, including Conceptual Modeling, Agent Based Modeling and Simulation, Interoperability, Ontologies, Knowledge Based Decision Support, Petri Nets, Business Process Modeling and Simulation, amongst others.

Conference Chair

Floriano De RangoUniversity of Calabria, Italy


Gerd WagnerBrandenburg University of Technology, Germany
Frank WernerOtto von Guericke University of Magdeburg, Germany
Tuncer Ören (honorary)University of Ottawa, Canada

Keynote Speakers

Marlon DumasUniversity of Tartu, Estonia
Peter FritzsonLinköping University, Sweden

 SCITEPRESS Digital Library
All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library
(consult SCITEPRESS Ethics of Publication)
Advances in Intelligent Systems and Computing

A short list of presented papers will be selected
so that revised and extended versions of these
papers will be published by Springer-Verlag in
Advances in Intelligent Systems and Computing
(final approval pending)
Journal of Simulation Engineering
A short list of papers presented at the conference
venue will be selected for publication of extended
and revised versions in a special issue of Journal of
Simulation Engineering

In Cooperation with:
Proceedings will be submitted for indexation by: